Semiconductor Packaging is increasingly important to the success of almost all electronic systems. One traditional packaging process that is still used extensively today is Wire Bonding. Although Wire Bonding is an established technology, there are still areas of development, such as fine pitch wire bonding, wire loop control, wire bonding with new metals, and new materials on the die that require re-thinking the process parameters associated with wire bonding. Wire Bonding is an 8-hour online course that offers detailed instruction on the technologies used to create the connections between the semiconductor die and the leadframe or substrate. This includes materials for wire bonding, equipment for wire bonding, key process parameters, and applications for wire bonding. We place special emphasis on current issues related to wire bonding on current generation products, as well as reliability issues. This course is a must for every manager, engineer and technician working in the semiconductor industry, using semiconductor components or supplying tools to the industry.